1997 Book Chapters
- Y.-C. Tai and C.-J. Kim, “Microelectromechanical Systems (MEMS)”, in The Industrial Electronics Handbook, Edited by J. D. Irwin, CRC Press and IEEE Press, 1997, pp. 1468-1471.
1997 Journal Papers
- J. Simon, S. Saffer, and C.-J. Kim, “A Liquid-Filled Microrelay with a Moving Mercury Micro-Drop”, J. Microelectromechanical Systems, Vol. 6, No. 3, Sept. 1997, pp. 208-216.
- B. Shivkumar and C.-J. Kim, “Microrivets for MEMS Packaging: Concept, Fabrication and Strength Testing”, J. Microelectromechanical Systems, Vol. 6, No. 3, Sept. 1997, pp. 217-225.
- Y.-I. Lee, K.-H. Park, J. Lee, C.-S. Lee, H.J. Yoo, C.-J. Kim, and Y.-S. Yoon, “Dry Release for Surface Micromachining with HF Vapor-Phase Etching”, J. Microelectromechanical Systems, Vol. 6, No. 3, Sept. 1997, pp. 226-233.
1997 Conference Papers
- J. Simon, L.-S. Huang, B. Sridharan, and C.-J. Kim, “Microgasketing and Room Temperature Wafer Joining for Liquid-Filled MEMS Devices”, Proc. MEMS, (DSC-Vol. 62 / HTD-Vol. 354) ASME Int. Mechanical Engineering Congress and Exposition, Dallas, TX. Nov. 1997, pp. 29-34.
- D. Wang, H. Alexander, Q. Chen, G.P. Carman, C.-J. Kim, and C.-M. Ho, “Piezoelectrically Driven Meso-Scale Actuator Device for Aerodynamic Control”, Proc. 38th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference and Exhibit and AIAA/ASME/AHS Adaptive Structures Forum, Kissimmee, FL, Apr. 1997, pp. 1738-1746.
- K. Ho, P. Jardine, G. P. Carman, C.J. Kim, “Modeling and Measuring the Response Times of Thin Film TiNi”, Smart Structures and Materials 1997: Smart Materials Technologies (SPIE Vol. 3040), San Diego, CA, March 1997, pp. 10-22 (Invited paper).
- B. Shivkumar and C.-J. Kim, “Microriveting - A New Wafer Joining Method”, Proc. IEEE Micro Electro Mechanical Systems Workshop, Nagoya, Japan, Jan. 1997, pp. 197-202.
- John Y. Kim and C.-J. Kim, “Comparative Study of Various Release Methods for Polysilicon Surface Micromachining”, Proc. IEEE Micro Electro Mechanical Systems Workshop, Nagoya, Japan, Jan. 1997, pp. 442-447.