24 Dec 2014

2001

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2001 Conference Papers

  1. D.-J. Yao, G. Chen, and C.-J. Kim, “Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler”, Proc. ASME Int. Mechanical Engineering Congress and Exposition, New York, NY, Nov. 2001, IMECE2001/MEMS-23901(4).
  2. W. Shen, J. Kim, and C.-J. Kim, “Resistance of Liquid-Metal Droplets Against Actuation on Microstructured Surfaces”, Proc. ASME Int. Mechanical Engineering Congress and Exposition, New York, NY, Nov. 2001, IMECE2001/MEMS-23831(6).
  3. S. K. Cho, H. Moon, J. Fowler, and C.-J. Kim, “Splitting a Liquid Droplet for Electrowetting-Based Microfluidics”, Proc. ASME Int. Mechanical Engineering Congress and Exposition, New York, NY, Nov. 2001, IMECE2001/MEMS-23830(7).
  4. C.-J. Kim, “Micropumping by Electrowetting”, Proc. ASME Int. Mechanical Engineering Congress and Exposition, New York, NY, Nov. 2001, IMECE2001/HTD-24200(8).
  5. F. Saeki, J. Baum, H. Moon, J.-Y. Yoon, C.-J. Kim, and R. L. Garrell, “Electrowetting on Dielectrics (EWOD): Reducing Voltage Requirement for Microfluidics”, American Chemical Society National Meeting, Chicago, IL, August 2001.
  6. R. T. Edwards and C.-J. Kim, “Breaking the Resistivity Barrier”, Proc. The 3rd NASA/DoD Workshop on Evolvable Hardware, July 2001, Pasadena, CA, pp. 167-171.
  7. J. Kim, W. Shen, L. Latorre, and C.-J. Kim, “A Micromechanical Switch with Electrostatically Driven Liquid-Metal Droplet”, Proc. Int. Conf. Solid-State Sensors and Actuators (Transducers’01), June 2001, Munich, Germany, pp. 748-751.
  8. D.-J. Yao, C.-J. Kim, G. Chen, J. L. Liu, K. L. Wang, J. Snyder, and J.-P. Fleurial, “MEMS Thermoelectric Microcoolers”, Proc. 20th International Conference on Thermoelectrics, Beijing, P. R. China, June 2001, pp. 401-404.
  9. J. Lee, H. Moon, J. Fowler, C.-J. Kim, and T. Schoellhammer, “Addressable Micro Liquid Handling by Electric Control of Surface Tension”, Proc. IEEE Conf. Micro Electro Mechanical Systems (MEMS ’01), Interlaken, Switzerland, Jan. 2001, pp. 499-502.
  10. S.-K. Fan, J.-A. Paik, P. R. Patterson, M. C. Wu, B. Dunn, and C.-J. Kim, “MEMS with Thin-Film Aerogel”, Proc. IEEE Conf. Micro Electro Mechanical Systems (MEMS ’01), Interlaken, Switzerland, Jan. 2001, pp. 122-125.
  11. K.-S. Yun, I.-J. Cho, J.-U. Bu, G.-H. Kim, Y.-S. Jeon, C.-J. Kim, and E. Yoon, “A Micropump Driven by Continuous Electrowetting Actuation for Low Voltage and Low Power Operations”, Proc. IEEE Conf. Micro Electro Mechanical Systems (MEMS ’01), Interlaken, Switzerland, Jan. 2001, pp. 487-490.